segmented structures, foamsMaterial of the matrix with a principal constituent of the material being a polymer, e.g.

segmented structures, foamsMaterial of the matrix with a principal constituent of the material being a polymer, e.g.

On entend par « puce » tout circuit ou composant électronique réalisé à partir d'une plaquette de cristal semi-conducteur. plate connectors, solder or adhesive layers; Manufacturing methods related theretoStructure, shape, material or disposition of the layer connectors prior to the connecting processStructure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connectorSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FORIndexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FORIndexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00Details of semiconductor or other solid state devices to be connectedPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTSIndexing scheme relating to printed circuits covered by H05K1/00Details of components or other objects attached to or integrated in a printed circuit boardDetails of electrical connections of non-printed components, e.g. 77 by photo-etch processPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTSApparatus or processes for manufacturing printed circuitsApparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive patternApparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. (b) Reconstructed pattern using the original SOM under 31.6% Gaussian white noise. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patternsA. « Caliste 64, an Innovative CdTe Hard X-Ray Micro Camera », IEEE Trans. segmented structures, foamsBase material with a principal constituent of the material being a metal or a metalloid, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related theretoSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FORArrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related theretoMethods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connectedMethods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connectorSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FORArrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related theretoMethods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connectedMethods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connectorPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTSApparatus or processes for manufacturing printed circuitsAssembling printed circuits with electric components, e.g. La Procédé d'interconnexion par retournement d'un composant électronique (P, D) sur un substrat (S, B), Procédé selon la revendication 1, comportant les étapes suivantes : Par rapport aux techniques d'interconnexion par fils (« wire bonding » en anglais), le retournement de puce permet une miniaturisation poussée des circuits électroniques et une réduction des inductances parasites. being a hybrid material, e.g.

Pattern Three black crows/ les trois corbeaux . segmented structures, foamsBase material with a principal constituent of the material being a metal or a metalloid, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related theretoLayer connectors, e.g. being a hybrid material, e.g.

boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereofSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FORIndexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related theretoBump connectors; Manufacturing methods related theretoManufacturing methods by local deposition of the material of the bump connectorManufacturing methods by local deposition of the material of the bump connector in solid formManufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumpsSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FORIndexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00Means for bonding being attached to, or being formed on, the surface to be connected, e.g.

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